Overview
- Reports published Monday by Wired and echoed across tech outlets said Intel is in advanced talks with Google and Amazon for packaging their custom AI chips.
- Advanced packaging links multiple small chips and high‑bandwidth memory into one module, a step now viewed as the main choke point for AI performance and supply.
- Intel says its EMIB and new EMIB‑T technologies will enter fab production this year, with volume preparations underway at its Rio Rancho, New Mexico facility.
- CFO Dave Zinsner has flagged potential deals worth billions of dollars and said packaging work could deliver roughly 40% gross margins.
- Prospective customers remain cautious about Intel’s ability to scale and possible TSMC pushback, and Intel’s foundry chief said higher capital spending would be the clearest public sign that large contracts are signed.