Overview
- Intel published official preview figures for 18A-P, a tuned version of its 18A chip process that uses gate-all-around RibbonFET transistors and backside power delivery called PowerVia.
- The company reports over 9% higher performance at the same power or over 18% lower power at the same performance, based on tests of an Arm core sub-block.
- Design changes add more threshold-voltage choices, tighten process skew corners by about 30%, and introduce new low-power devices to improve predictability and binning.
- Intel says thermal conductivity improves by about 50%, with added gains in reliability and low-voltage stability that help both laptop and data center chips run within safer limits.
- Key layout rules such as contacted poly pitch and library heights match 18A for easier porting, and industry reports name Apple as a potential user, though no customer is confirmed.