Overview
- Multiple reports say Intel is in advanced talks with Google and Amazon to package their AI chips, though the companies declined to discuss the talks.
- Intel says EMIB‑T, due to enter production this year, adds through‑silicon vias to its bridges to support very large AI packages up to 120 by 180 millimeters.
- The company has rebuilt Rio Rancho, New Mexico, into packaging lines with $500 million in U.S. support and is adding assembly and test capacity in Penang, Malaysia, with first‑phase operations expected later this year.
- Foundry chief Naga Chandrasekaran said the clearest sign that customers have committed will be a visible jump in Intel's capital spending.
- Analysts warn advanced packaging is becoming a choke point for AI hardware, and TSMC still routes even U.S.‑made chips back to Taiwan for that step, which creates an opening for a U.S.‑based option.