Overview
- Union minister Ashwini Vaishnaw outlined the plan after meeting 24 chip-design firms selected under the Design-Linked Incentive scheme.
- Phase two will prioritize compute, RF, networking, power, sensor and memory chips to expand domestic design and manufacturing control.
- By 2029, officials expect capability to cover roughly 70–75% of chips used across Indian applications.
- Authorities said academia and industry will be encouraged to develop IP and solutions across the six focus areas.
- Four plants—CG Semi, Kaynes, Micron and Tata Electronics’ Assam facility—are reported to be slated for commercial production in 2026.