Overview
- The foundation-laying in Bhubaneswar on Sunday moves the first glass-substrate chip packaging plant from approval to build-out.
- US-based 3D Glass Solutions, through its Indian subsidiary, will set up the India Semiconductor Mission–approved Rs 1,934–1,943 crore facility, with Intel reported among investors and its CEO joining virtually.
- At scale, planners expect about 69,600–70,000 glass panels, 50 million assembled units, and roughly 13,000 3DHI modules a year, along with about 2,500 jobs.
- The plant will use glass substrates for 3D stacking, which cut signal loss and handle heat better than organic packages, supporting high-performance chips for AI, 5G, defence and data centres.
- Odisha is pitching Info Valley as a semiconductor hub under the India Semiconductor Mission, which has approved ten projects nationwide and also backed a silicon carbide fab now under construction in the state.