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IBM Connects First Modular Cryogenic Units to Advance Fault-Tolerant Quantum Roadmap

The successful cooling and linkage of two refrigerator modules proves the design can hold linked processors at millikelvin temperatures and paves the way for multi-module deployments that scale qubit counts.

Overview

  • IBM announced on Wednesday that it built, cooled and connected the first two modular cryogenic dilution refrigerator units and validated joint operation at below 15 millikelvin.
  • Under a 30-microwatt simulated heat load meant to mimic wiring and electronics, the paired modules operated at 23 millikelvin, showing the design can tolerate realistic internal heat.
  • The modules contain no processors yet but IBM plans to install one Nighthawk processor in each unit later this year to test in-module operation and cross-module communication.
  • IBM reports its L-coupler superconducting link has achieved a best cross-module two-qubit fidelity of 99.3 percent with a target of 99.9 percent for fault-tolerant systems, and it expects initial multi-module deployments in 2027 that will use two or three cells to support roughly 1,000 physical qubits.
  • The effort fits into a broader ecosystem plan that includes partner Bluefors delivering modular cryogenic platforms late in 2026 and aims to reach IBM’s Starling fault-tolerant machine that will need about 12 modules by 2029, with modular design chosen to provide roughly 12 times more wiring space and easier testing, shipping and maintenance.