Overview
- Huawei showcased 61.44TB and 122.88TB enterprise SSDs at its ID Forum in Paris, with a 245TB variant reported to be in development.
- The drives use Die-on-Board (DoB) packaging, which mounts bare NAND dies directly on the printed circuit board and increases capacity density by about 33 percent.
- Because U.S. export controls have limited access to the highest-layer 3D NAND, Huawei relies on YMTC’s Xtacking 4.0 chips, which are currently around 232 layers.
- Huawei is integrating the 122.88TB drives into its OceanStor Pacific 9926 array to reach up to 4.42 petabytes of raw capacity in a 2RU chassis and has introduced the OceanDisk 1800 to address DoB thermal and signal challenges.
- Huawei said it will form an AI SSD Innovation Alliance to tune software for AI inference workloads, a step that could let packaging and system integration offset some hardware-layer gaps caused by export controls and influence China’s storage supply chain.