Overview
- According to Nikkei reporting, HP and Dell have begun qualifying CXMT DDR5, while Acer and Asus are asking Chinese manufacturing partners to source locally made memory chips.
- Global suppliers have redirected wafer starts to high‑bandwidth memory for AI, leaving consumer DRAM short and pushing prices sharply higher.
- CXMT and YMTC are advancing major fabs in Shanghai and Wuhan with volume production targeted around 2027, with YMTC allocating part of its new capacity to DRAM alongside NAND.
- CXMT has demonstrated DDR5 designs and reportedly sent HBM samples to domestic AI customers such as Huawei, yet it remains behind the leading edge and mass production is delayed.
- Export controls limiting advanced lithography and packaging have forced Chinese firms to use older tools and workarounds that raise costs, but OEM validation efforts signal possible commercial uptake after testing.