Google Seeks Samsung for Icefish I/O Die as MediaTek Moves to System-Level AI Hardware

Overview

• Monday reports say Google has held talks with Samsung to make the memory input‑output die for its next TPU, codenamed Icefish, while TSMC would retain the main compute die.
• Industry analysts view the Samsung talks as a capacity‑management step driven by TSMC constraints rather than a full shift away from TSMC.
• Splitting chip production between different foundries raises technical risks around packaging, high‑bandwidth memory integration, coordination and final yields.
• MediaTek is pivoting from chip design to board‑ and rack‑level system integration, targeting TPU board work with Google and rack work for Musk‑affiliated firms while pursuing a 40–50% gross‑margin, asset‑light model.
• Experts say MediaTek’s move is a long‑term repositioning that is unlikely to materially affect earnings in the next two years and that qualification, yield and timing uncertainties mean mass production targets remain unclear.