Overview
- Delhi officials said Sunday they have begun drafting a 'Delhi Semiconductor Policy' to build a hub for chip design, research and advanced packaging.
- Leaders outlined five pillars covering design and IP, research and innovation, assembly and testing known as ATMP and OSAT, talent development, and a stronger startup base.
- The strategy avoids costly chip fabrication and targets less capital-intensive segments such as design, R&D and advanced packaging.
- The government expects high-skill jobs in chip design and packaging, backed by training, internships and partnerships between industry and universities.
- Officials said the draft will align with the India Semiconductor Mission to attract fabless firms and packaging units through a mix of financial and non-financial incentives under consideration.