Overview
- CXMT said it has begun mass production of LPDDR6 mobile memory that Xiaomi will use in its upcoming 18 Fold smartphone, a commercial deployment the company publicly tied to the handset.
- The initial LPDDR6 supply appears limited to a single flagship model with reported Xiaomi shipment targets of roughly 200,000–300,000 units, which suggests low early volume for CXMT’s mass‑production claim.
- Multiple outlets report CXMT has started small‑scale or risk production and customer testing of HBM3E high‑bandwidth memory with Chinese AI chip designers such as Alibaba’s T‑Head and Cambricon.
- Early HBM production faces steep manufacturing challenges, with reported yields near 25% for 8‑die stacks and continued reliance on older DUV lithography because U.S. export controls block access to ASML’s EUV tools.
- CXMT’s July Shanghai IPO raised about 57.9 billion yuan and the company has expanded capacity and revenue rapidly, but broader market impact will depend on improving yields, completing customer qualification and scaling production in 2027.