Overview
- Broadcom on Wednesday announced three integrated Wi‑Fi 8 system‑on‑chips — BCM6772, BCM6774 and BCM6776 — and said the BCM677x family is now sampling to early access partners.
- The new chips put the application CPU, network processor, 2.4/5/6 GHz Wi‑Fi radios and multi‑gigabit Ethernet PHY on one die to simplify router and mesh designs and reduce board complexity.
- Broadcom and Samsung said they are jointly sampling a reference FWA platform that pairs the BCM6776 with Samsung’s 5nm B1320 modem, which supports 3GPP Release 17 and multi‑gigabit 5G throughput.
- OEMs and ODMs including ASUS, NETGEAR, TP‑Link, Humax and others have publicly endorsed the integrated approach and are integrating the platform into gateway prototypes.
- Broadcom and Samsung say global carrier trials are underway but broad commercial shipments have not started yet; the companies argue the lower bill‑of‑materials and up to ~50% cut in active power use could let operators deliver fiber‑like home broadband via fixed wireless access.