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Broadcom, Meta Strike Multi-Year Custom-Chip Partnership Exceeding 1GW

The deal deepens Broadcom’s AI pipeline and gives clearer revenue visibility that many on Wall Street expect to accelerate in 2027.

Overview

  • Meta and Broadcom agreed to co-design Meta’s AI accelerator chips with an initial commitment above 1 gigawatt of compute capacity, using Broadcom’s XPU platform and its optical and Ethernet networking through 2029.
  • As part of the expanded tie-up, Broadcom CEO Hock Tan will leave Meta’s board and serve as an advisor to the company.
  • Broadcom also disclosed April agreements with Google and Anthropic, including Anthropic’s 3.5GW compute commitment that the company said is expected to start coming online in 2027.
  • Shares of Broadcom have jumped about 28% in April, extending an eight-session rally and trading near the stock’s record closing high.
  • Analysts raised forecasts after the deals, with UBS lifting its 2027 TPU shipment view to 7 million units and BofA projecting $1.3 trillion in 2026 semiconductor revenue, while Goldman cited stronger long-term AI revenue visibility and flagged risks from slower AI spending, competition in custom compute, and non-AI inventory digestion.