Overview
- Broadcom on Wednesday unveiled three integrated Wi‑Fi 8 system‑on‑chips—BCM6772, BCM6774 and BCM6776—that put application and network processors, multi‑band Wi‑Fi radios and multi‑gigabit Ethernet PHYs on a single die.
- The company also announced a collaboration with Samsung that pairs the BCM6776 with Samsung’s B1320 5G modem in an industry‑first fixed wireless access reference platform now in OEM sampling and carrier trials.
- The BCM6776 includes a quad‑core CPU complex, a dedicated network processing engine, integrated 2x2 2.4 GHz and 4x4 5/6 GHz radio blocks, on‑chip 2.4 GHz power amplifiers and dual PCIe Gen3 controllers while Samsung says the B1320 can reach about 3.43 Gbps downlink and 1.17 Gbps uplink on Release 17 5G.
- Broadcom and Samsung said the BCM677x family is sampling to early partners and that the combined B1320/BCM6776 platform is undergoing global carrier trials, with broader commercial shipments not yet reported.
- By cutting component count, board complexity and active power use, the integrated chips aim to shrink device size and bill of materials and could speed operator rollouts of multi‑gigabit home broadband over fixed wireless and mesh gateways in the near term.