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Besi Q1 Orders More Than Double on AI Packaging Demand

The results signal an AI-led rebound in chip equipment spending focused on hybrid bonding.

Overview

  • Besi reported first-quarter bookings of €269.7 million, up 104.5% from a year earlier, driven by strong demand across markets for its hybrid bonding tools.
  • The company posted Q1 revenue of €184.9 million and net income of €51.6 million, increases of 28.3% and 63.8% from the prior year.
  • Management guided second-quarter revenue to rise 30% to 40% from Q1 and projected a higher gross margin of 64% to 66% with operating expenses up 0% to 10%.
  • Hybrid bonding stacks two chips directly to boost bandwidth and density, a key step for faster AI accelerators that is helping Besi win orders.
  • Executives said AI spending is offsetting weaker demand in autos, PCs, and memory, a trend echoed by recent updates from TSMC, ASML, and ASM International.