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ASML Says First High‑NA Chips Are Weeks Away as Customers Split Over $400M Tool Cost

The milestone could validate ASML’s next‑generation lithography and change chipmaking costs if customers commit to the expensive systems.

ASML Chief Executive Officer Christophe Fouquet delivers a keynote during the Imec Technology Forum 2026 (ITF) in Antwerp, Belgium May 19, 2026. REUTERS/Yves Herman
ASML Chief Executive Officer Christophe Fouquet delivers a keynote during the Imec Technology Forum 2026 (ITF) in Antwerp, Belgium May 19, 2026. REUTERS/Yves Herman
ASML Chief Executive Officer Christophe Fouquet delivers a keynote during the Imec Technology Forum 2026 (ITF) in Antwerp, Belgium May 19, 2026. REUTERS/Yves Herman
ASML Chief Executive Officer Christophe Fouquet delivers a keynote during the Imec Technology Forum 2026 (ITF) in Antwerp, Belgium May 19, 2026. REUTERS/Yves Herman

Overview

  • This week ASML’s CEO Christophe Fouquet told an industry conference that the first chips exposed on High‑NA EUV machines are expected within months, covering both memory and logic applications.
  • Each High‑NA system carries a reported price tag near $400 million, which has prompted serious pushback from TSMC and is a central barrier to broader adoption.
  • Intel and SK Hynix have shown early interest in adopting High‑NA tools for targeted processes, while other leading foundries plan to keep using current EUV platforms for several more generations.
  • Investors responded to the news on top of strong Q1 results and raised guidance: UBS upgraded ASML to its top European semiconductor pick and Coatue filed a roughly $655 million new position, reflecting active institutional buying.
  • ASML’s unique supply role means the near term will hinge on customer qualification decisions, order cadence and ASML’s delivery capacity, with the company’s next earnings and tool qualification updates the key milestones to watch.