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Applied Materials and TSMC Launch Co‑Innovation at EPIC Center to Speed AI Chips

The deal uses a new $5 billion Silicon Valley hub to cut the time from lab research to factory output.

Overview

  • A partnership announced Monday between Applied Materials and TSMC sets up joint R&D for next‑generation AI chips at Applied’s EPIC Center in Silicon Valley.
  • The work targets new materials, chipmaking tools, and process integration to build smaller, more efficient logic chips and complex 3D transistors and interconnects.
  • EPIC is a planned $5 billion investment that Applied says will be operational this year with a mission to move breakthroughs into high‑volume manufacturing faster.
  • TSMC becomes a founding partner with earlier access to Applied’s engineers and next‑gen equipment, while both firms kept financial terms undisclosed.
  • The effort builds on EPIC’s growing ecosystem, which includes an on‑campus Advantest test hub, and reflects AI‑driven demand that companies and analysts say is speeding chip roadmaps.