Overview
- Apple, which announced the expansion Thursday, will fund projects through 2030 to make sensors, chips and semiconductor materials in the U.S. for devices sold worldwide.
- TDK will produce tunnel magnetoresistance sensors in the U.S. for the first time, tiny magnetic parts that help steady iPhone cameras.
- Apple, Bosch and TSMC will build sensing chips at TSMC’s Camas, Washington site, and Cirrus Logic with GlobalFoundries in Malta, New York will develop mixed-signal chips used for Face ID.
- Qnity Electronics with HD MicroSystems will supply materials used to make semiconductors and high‑performance computing parts for AI.
- Coverage notes the focus is components rather than U.S. iPhone assembly and links the move to tariff pressure and President Donald Trump’s push, as Apple plans to buy well over 100 million chips from TSMC’s Arizona fab in 2026 after sourcing more than 20 billion U.S.-made chips to date.