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Apple Commits More Than $30 Billion to Broadcom for U.S. Chip Production

Locking in U.S. supply of custom radio‑frequency and connectivity chips, the pact funds a Fort Collins plant modernization.

Overview

  • Apple and Broadcom announced a multiyear agreement on Wednesday, July 8, 2026, that the companies say is expected to exceed $30 billion in spending for custom silicon and wireless components.
  • The deal will produce more than 15 billion U.S.-made chips and, according to Apple, will support hundreds of American jobs across the supply chain.
  • Broadcom will invest $1.5 billion to expand and modernize its Fort Collins, Colorado, facility to make FBAR radio‑frequency filters and other Wi‑Fi/Bluetooth connectivity parts.
  • A Broadcom SEC filing says the pact includes commitments to develop and supply custom ASICs for multiple Apple product generations through 2031, but Apple has not provided a detailed production timetable or capacity ramp plan.
  • The agreement is Apple’s largest commitment under its American Manufacturing Program and sits inside a broader $600 billion U.S. investment pledge, a move that aims to secure domestic component supply as demand for specialized chips grows.