Overview
- The companies announced a multiyear pact on July 8 that commits about $30 billion for the design and U.S. manufacture of more than 15 billion connectivity and customized ASIC chips.
- Broadcom will invest $1.5 billion to expand its Fort Collins, Colorado plant, where it will build radiofrequency filters, Wi‑Fi/Bluetooth parts and other wireless components for Apple devices.
- Broadcom told the SEC that the supply commitments for custom application‑specific integrated circuits extend through 2031, giving Apple multi‑year certainty for chips used in AI and connectivity tasks.
- The deal raises U.S.-made component content but does not move final iPhone assembly out of Asia, and Apple is separately evaluating alternative suppliers such as Chinese DRAM maker CXMT for China‑market devices.
- The agreement is part of Apple’s larger U.S. manufacturing program and aims to strengthen supply resilience, support U.S. jobs in chip production, and reduce dependence on overseas component sourcing while Apple continues to use TSMC for its A‑ and M‑series processors.