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3D-Printed Copper ‘Godzilla’ Fins Boost Chip Cooling in Peer-Reviewed Study

The results highlight a possible route to trim data-center cooling power during a surge in chip heat.

Overview

  • The peer-reviewed study, which was published Thursday, reports up to 32% better heat transfer and 68% lower pressure drop versus standard cold plates.
  • The team used topology optimization to design jagged, spike-like fins and built pure copper features using Fabric8Labs’ electrochemical additive manufacturing, which prints metal by electrodeposition.
  • A 2 cm by 2 cm prototype cooled gallium nitride chips in lab tests, and the lower pressure drop means pumps need less energy to move the liquid.
  • Based on the lab data, the authors estimate that cooling for a 1 gigawatt data center could drop to about 11 megawatts, or roughly 1–1.1% of total power use.
  • Researchers and independent experts call the approach promising, though real-server trials, cost analysis, and proof of high-volume manufacturing are still needed.